US 4,785,343 AGranted

MIS FET semiconductor device with improved leakage current

AssigneeFujitsu Limited

InventorAkio Nezu

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Abstract

The present invention relates to a MIS FET having an additional gate electrode (referred to as a suppression gate electrode) which extends along a boundary region between a MIS FET active region and a field oxide film under a drain wiring. When the drain wiring is supplied with a voltage high enough to induce an inversion layer of the same polarity as the MIS FET channel, a parasitic transistor is formed in parallel with the MIS FET and creates an increase in leakage current. A suppression gate electrode of the present invention forms an interrupting transistor connected in series with the parasitic transistor and therefore cuts off the leakage current.

Claims9

Dependent claims

A MIS FET semiconductor device comprising:

a semiconductor substrate of a first conductivity type;
an active region formed in said substrate and composed of a source region, a drain region and a channel region disposed between said source and drain regions, said source region and drain region of a second conductivity type opposite the first conductivity type;
a field oxide film formed on said substrate and surrounding said active region;
a gate insulating film formed on said channel region, and having a thickness thinner than said field oxide film;
a gate electrode formed on said gate insulating film such that said gate electrode extends across the active region and extends onto the field oxide film at one end thereof, and such that a portion of said gate electrode at an opposite end thereof, overlies said field oxide film and is spaced apart from said active region;
an insulating layer covering the entire surface of said substrate;
a drain electrode formed on said insulating layer connected to said drain region through contact holes formed in said insulating layer;
a drain wiring formed on said insulating layer and connected to said drain electrode, said drain wiring extending above two regions, the first region including a first boundary region between the source region and the field oxide region, and a narrow area in the active region abutting said first boundary region, and the second region including a second boundary region between the drain region and the field oxide region, and a narrow area in the active region abutting said second boundary region, said first and second regions being located on both sides of said channel region, where said source and drain regions extend to said first and second boundary regions at said one end, and extend to said field oxide film at said other end;
a suppression gate insulating film formed on at least one of said first and second boundary regions and having a thickness substantially the same as the thickness of the gate insulating film, and;
a suppression gate electrode extending from said gate electrode and disposed over at least one of said first and second boundary regions and on said suppression gate insulating film in said active region near said one end of said gate electrode, said suppression gate formed beneath said insulating layer and substantially under said drain wiring.

7 more elements

Dependencies are inferred from the claim text.

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Abstract

A MIS FET semiconductor device comprising:

a semiconductor substrate of a first conductivity type;
an active region formed in said substrate and composed of a source region, a drain region and a channel region disposed between said source and drain regions, said source region and drain region of a second conductivity type opposite the first conductivity type;
a field oxide film formed on said substrate and surrounding said active region;
a gate insulating film formed on said channel region, and having a thickness thinner than said field oxide film;
a gate electrode formed on said gate insulating film such that said gate electrode extends across the active region and extends onto the field oxide film at one end thereof, and such that a portion of said gate electrode at an opposite end thereof, overlies said field oxide film and is spaced apart from said active region;
an insulating layer covering the entire surface of said substrate;
a drain electrode formed on said insulating layer connected to said drain region through contact holes formed in said insulating layer;
a drain wiring formed on said insulating layer and connected to said drain electrode, said drain wiring extending above two regions, the first region including a first boundary region between the source region and the field oxide region, and a narrow area in the active region abutting said first boundary region, and the second region including a second boundary region between the drain region and the field oxide region, and a narrow area in the active region abutting said second boundary region, said first and second regions being located on both sides of said channel region, where said source and drain regions extend to said first and second boundary regions at said one end, and extend to said field oxide film at said other end;
a suppression gate insulating film formed on at least one of said first and second boundary regions and having a thickness substantially the same as the thickness of the gate insulating film, and;
a suppression gate electrode extending from said gate electrode and disposed over at least one of said first and second boundary regions and on said suppression gate insulating film in said active region near said one end of said gate electrode, said suppression gate formed beneath said insulating layer and substantially under said drain wiring.

7 more elements