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US 4,768,581 AGranted
Cooling system for semiconductor modules
AssigneeInternational Business Machines Corporation
InventorsCharles A. Gotwald, Sevgin Oktay, Ajay Sharma, Vijay Sonnad, Arthur R. Zingher
Life of this patent
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Abstract
A cooling structure for a semiconductor package wherein the cooling fluid is circulated over the cooling fins over short distances. The fluid flow is separated into multiple flow streams, passed over the fins for short distances and exhausted.
Claims18
An improved system for cooling electronic elements comprising
- a base element adapted to receive heat from electronic elements,
- a plurality of spaced fins mounted on said base element,
- at least one elongated duct means mounted over said spaced fins, said duct means provided with a pair of flat bottom wall members in engagement with the upper ends of said fins, and an upwardly bulged top wall member joined to the outer edges of said pair of bottom wall members, said duct means having at least one open end,
- a plenum mounted on said base member for conveying cooling fluid through said system,
- said system in operation adapted to pass cooling fluid through said plenum, then through said fins and then through said duct means.
2 more elements
A system for cooling electronic elements comprising:
- a base element adapted to receive heat from electronic elements,
- a plurality of fins mounted on said base element,
- a blower to direct cooling gas downwardly toward said base element,
- a means to funnel said cooling gas to said fins,
- a duct means distinct from said funnel means over said fins to convey said cooling gas away from said fins,
- said system in operation adapted to move cooling gas through said funnel means, then inwardly between said fins, and then exhaust said gas upwardly and transverse to said fins through said duct means.
3 more elements
Dependencies are inferred from the claim text.