Integrated circuit probe parallelism establishing method and apparatus
AssigneeTektronix, Inc.
InventorCornelis T. Veenendaal
Life of this patent
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AssigneeTektronix, Inc.
InventorCornelis T. Veenendaal
Estimating the term…
A probe mount carries a probe with test points having ends in a test point plane. The probe mount is supported at three spaced apart locations by respective first, second and third supports, each adjacent to a respective one of the test points. These probe supports permit independent shifting of each of the three locations along respective parallel lines. As these locations are shifted relative to one another, the test point plane is tilted until it is parallel to a second plane containing the surface of an integrated circuit wafer to be probed. A test surface is positioned in the second plane and advanced toward the probe. As the test points contact the test surface, the test point plane is tilted. Microprocessor controlled stepper motors may be used to tilt the test point plane and to shift the test surface.
An apparatus used in testing an integrated circuit wafer having a surface, for establishing parallelism between a first plane within an integrated circuit probe having at least a first, a second and a third test point separately disposed therein, said test points each having a distal end thereof and said first plane being defined by the physical location of said distal ends of said test points, and a second plane containing the surface of an integrated circuit wafer to be probed, comprising:
An apparatus used in testing an integrated circuit wafer having a surface, for establishing parallelism between a first plane within an integrated circuit probe having at least a first, a second and a third test point separately disposed therein about a center of said probe, said test points each also having a distal end thereof and said first plane being defined by the physical location of said distal ends, and a second plane coincident with or parallel to a test surface, comprising:
A method for establishing parallelism between a first plane containing the ends of test points, including first, second and third spaced apart test points, of an integrated circuit probe and a second plane, the first plane initially being generally parallel to and spaced a first distance in a first direction from the second plane, comprising:
Dependencies are inferred from the claim text.