Heat dissipation mechanism for power semiconductor elements

A power semiconductor assembly with evaporative cooling, comprising a power semiconductor column in which power semiconductor elements are arranged in alternation and in thermal contact with evaporation blocks of good heat conducting material, each said evaporation block having a fluid inlet and a fluid outlet and being connected in a corresponding heat-dissipating fluid circuit, the corresponding fluid circuits of said evaporating blocks being separate from one another, each fluid circuit including respective heat exchange means having a fluid inlet connected to said fluid outlet of the corresponding evaporator block by way of a first flexible, electrically insulating fluid connection of that fluid circuit and a fluid outlet connected to said fluid inlet of the corresponding evaporation block by way of a second flexible, electrically insulating fluid connection of that fluid circuit, each fluid circuit containing a dielectric heat-carrying fluid which circulates between said corresponding evaporation block and said heat exchange means, the circulating fluid providing a heat dissipation effect by evaporating due to heating in said corresponding evaporation block, passing to said heat exchange means through said first connection, condensing due to cooling in said heat exchange means, and returning to said corresponding evaporation block through said second connection.