Copper-base alloys for leadframes
AssigneeHitachi Metals, Ltd.
InventorsDaiji Sakamoto, Rikizo Watanabe
Life of this patent
Estimating the term…
Abstract
A copper-base alloy for leadframes consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti and 0.05-0.6 weight % of Mg, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4. This copper-base alloy has high mechanical strength of about 50 kgf/mm.sup.2 or more and electric conductivity of 30% IACS or more as well as good solderability and solder durability. Thus, it may be used as a highly reliable material for leadframes of semiconductor devices.
Claims7
A copper-base alloy for leadframes consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti and 0.05-0.6 weight % of Mg, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4.
A copper-base alloy for leadframes consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, 0.05-0.6 weight % of Mg and 0.1-1.0 weight % of Mn in total, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4.
A leadframe for use in semiconductor devices, said leadframe being made of a copper-base alloy consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti and 0.05-0.6 weight % of Mg, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4.
A leadframe for use in semiconductor devices, said leadframe being made of a copper-base alloy consisting essentially of 0.8-4.0 weight % of Ni, 0.2-4.0 weight % of Ti, 0.05-0.6 weight % of Mg and 0.1-1.0 weight % of Mn in total, the balance being essentially Cu and inevitable impurities, and a ratio of Ni to Ti being 1-4.
Dependencies are inferred from the claim text.