Apparatus for cooling high-density integrated circuit packages
AssigneeTechnology Enterprises Company
InventorJohn M. Cutchaw
Life of this patent
Estimating the term…
Abstract
An apparatus for containing and cooling high-density integrated circuit packages includes a housing in which the circuit package is sealingly mounted in an internal chamber of said housing. The chamber is at least partially filled with a plurality of thermally conductive spheroids which are biased into thermally conductive contact with each other and with the integrated circuit package to maximize the heat exchange surface. The apparatus includes an inlet and an outlet for passing a dielectric immersion coolant through the chamber in direct heat exchange relationship with the spheroids and with the high-density integrated circuit package.
Claims19
An apparatus for containing and cooling a high-density integrated circuit package comprising in combination:
- (a) a base housing defining an upwardly opening chamber;
- (b) at least one high-density integrated circuit package mounted in the bottom of the upwardly opening chamber of said base housing, said circuit package including a substrate having at least one discrete integrated circuit mounted on the upper surface of said substrate;
- (c) said base housing being configured so that upwardly opening chamber thereof is deeper than the height dimension of said high-density integrated circuit package;
- (d) a plurality of thermally conductive spheroids in said upwardly opening chamber of said base means so as to substantially fill that chamber and be thermally conductive contact with said high-density integrated circuit package;
- (e) a cover demountably attached on the upper end of said base housing for sealingly enclosing the upwardly opening chamber of said base housing;
- (f) biasing means interposed between said plurality of spheroids and said cover for biasing said spheroids into thermally conductive contact with each other and with said high-density integrated circuit package;
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- (g) an inlet port and an outlet port by which a dielectric immersion coolant is passable through the chamber defined by said base housing.
An apparatus for containing and cooling high-density integrated circuit packages comprising in combination:
- (a) a base housing defining an upwardly opening chamber;
- (b) at least one high-density integrated circuit package mounted in the chamber of said base housing, said package including,
- i. an edge board connector having an elongated socket with an upstanding guide track on each of its opposite ends.
- ii. a printed circuit board demountably mounted in said edge board connector;
- (c) said base housing being configured so that the upwardly opening chamber thereof is deeper than the height dimension of said circuit package and is longer than the length dimension of said circuit package to provide a coolant distribution chamber in one end of said base housing and a coolant collection chamber in the opposite end thereof;
- (d) an inlet port in the one end of said base housing for admitting a dielectric immersion coolant into the coolant distribution chamber and an outlet port in the opposite end of said base housing throughwhich the dielectric immersion coolant exits said base housing;
- (e) a pair of perforated partition means each at a different end of said edge board connector for separating the coolant distribution chamber and the coolant collection chamber from said integrated circuit package;
- (f) a plurality of thermally conductive spheroids in said upwardly opening chamber of said base means and located between said pair of perforated partition means so as to substantially fill the space between said pair of perforated partition means and be in thermally conductive contact with said high-density integrated circuit package;
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- (g) a cover demountably attached on the upper end of said base means for sealingly enclosing the upwardly opening chamber of said base housing.
Dependencies are inferred from the claim text.