Temperature controller for semiconductor devices
AssigneeFuji Photo Film Co., Ltd.
InventorHideo Watanabe
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Abstract
A temperature controller includes a block-shaped heat sink in which a plurality of semiconductor devices to be controlled are mounted, a temperature sensor mounted in the heat sink, and a temperature controlling element mounted on the heat sink. The temperature sensor detects the temperature of the semiconductor devices through the heat sink, and the temperature controlling element responds to an output signal from the temperature sensor for controlling the temperature of the semiconductor devices through the heat sink so that the temperature will be substantially constant. Therefore, the semiconductor devices can be simultaneously controlled in temperature through the single temperature sensor and the single temperature controlling element.
Claims8
A temperature controller for controlling the temperature of a plurality of semiconductor devices, comprising:
- (i) a block-shaped heat sink in which the semiconductor devices are mounted, said semiconductor devices being arranged in spaced relation as a straight array in said heat sink:
- (ii) a temperature sensor mounted in said heat sink;
- and
- (iii) a temperature controlling device mounted on said heat sink and responsive to an output signal from said temperature sensor for controlling the temperature of the semiconductor devices so that the temperature will be substantially constant, wherein said temperature sensor and said temperature controlling element are positioned more closely to one of said semiconductor devices than the remaining semiconductor devices.
A temperature controller for controlling the temperature of a plurality of semiconductor devices, comprising:
- (i) a block-shaped heat sink in which the semiconductor devices are mounted;
- (ii) a temperature sensor mounted in said heat sink;
- and
- (iii) a temperature controlling device mounted on said heat sink and responsive to an output signal from said temperature signal for controlling the temperature of the semiconductor devices so that the temperature will be substantially constant, wherein said temperature sensor and said temperature controlling device are positioned in equidistant relation to each of said semiconductor devices.
Dependencies are inferred from the claim text.