High density integrated circuit package

A high-density integrated circuit package comprising:

• a monolithic multifaceted ceramic body composed of a plurality of ceramic layers fused together to form said body, said body having at least four faces, one of said faces comprising a mounting surface;
• input-output means affixed to said body proximate to said body mounting surface;
• electrically conductive contact sites disposed on at least two of said faces of said body in a predetermined pattern;
• conductive paths disposed on and conductive vias extending through selected ones of said layers and electrically interconnecting selected contact sites with other selected contact sites and electrically interconnecting selected ones of said contact sites with selected ones of said input-output means;
• a plurality of chip carriers, each adapted to receive at least one integrated circuit die, said chip carriers having electrical contacts oriented on respective carriers in a pattern corresponding to contact sites on respective faces of said body, said electrical contacts on said chip carriers being electrically connected to corresponding contact sites on the respective faces of said body upon mating of said carriers with the respective faces of said body.

A high-density package for receiving multiple integrated circuit devices thereon, comprising:

• a predetermined plurality of insulative layers laminated together in a direction of lamination to form a unitary three-dimensional body having at least four exterior faces, one of said faces being a mounting surface;
• said layers having peripheral edges which define, in the direction of lamination, at least some of said exterior faces, said plurality of layers forming at least some of said exterior faces being selected to provide a total dimension in the direction of lamination sufficient to support at least one integrated circuit device having a defined interconnection pattern;
• selected ones of said layers having conductive paths dispsed thereon, at least some of said paths terminating at at least one of said exterior faces defining contact sites in an interconnection pattern corresponding to said interconnection pattern of said at least one circuit device;
• input-output means operatively associated with one of said exterior faces and electrically connected with selected ones of said conductive paths on at least some of said layers;
• a plurality of chip carriers, each adapted to receive at least one integrated circuit die, said chip carriers having contacts oriented for interconnection with said face contact sites upon mating of said carriers with respective faces of said body.

A high-density integrated circuit package adapted to receive integrated circuit carrying devices comprising:

• a monolithic multifaceted ceramic body composed of a plurality of ceramic layers fused together to form said body, said body having a plurality of faces, one of said faces being a mounting surface;
• plural input-output means affixed to said body proximate to said body mounting surface;
• contact sites disposed on at least two of said faces, at least some of said contact sites oriented in a predetermined pattern to mate with contacts of integrated circuit carrying devices;
• conductive paths disposed on and conductive vias extending through selected ones of said layers, said paths and vias electrically interconnecting selected contact sites with other selected contact sites and electrically interconnecting ones of said contact sites with selected ones of said input-output connections;
• each of said faces being adapted to receive at least one integrated circuit die and at least one integrated circuit die is affixed to at least one of said faces, said package further including a lid on each of the die receiving faces to encapsulate respective die between respective lids and faces;
• said lids having a body confronting surface and an outer surface opposing said body confronting surface and having conductive test points on said outer surface;
• said lids including conductive vias extending through the lids from the test points on said outer surface and terminating on said body confronting surface in locations selected to electrically connect with selected ones of said face contact sites, thereby providing electrical access to face contact sites after mating of the lids with respective faces.