Socket for zig-zag inline package
AssigneeAMP Incorporated
InventorsTimothy B. Billman, Joseph R. Goodman, Gary R. Marpoe, Jr.
Life of this patent
Estimating the term…
Abstract
A connector for interconnecting a zig-zag inline package to a printed circuit board has a plurality of contacts in two parallel and offset rows. The contacts are dimensionally controlled to be preloaded only when installed in the housing cavity, providing predictable preload and resultant insertion force. The connector also includes a decoupling capacitor, integral with the contacts which contact the power and ground lead of the integrated circuit package.
Claims20
An electrical socket for electrically connecting an integrated circuit package thereto, the package including a body portion and a lead frame portion having a plurality of leads all of which extend from one side edge of the body portion, the leads formed into two parallel rows with every other lead staggered, the socket comprising:
- an insulative housing having axially extending sidewalls, endwalls and a central support rib which extends along the axial centerline of the housing, the housing having two parallel rows of contact receiving cavities opening onto an upper package receiving face, each row of cavities being on opposite sides of the central support rib, the cavities in a first row being axially staggered from the cavities in a second row, the lateral centerlines of the cavities in the first row being equally spaced between the lateral centerlines of adjacent cavities in the second row, the cavities being further defined by cavity walls which are transverse to the central support rib and laterally spaced to define the staggered cavities, the periphery of each cavity being defined by a floor having an aperture extending therethrough, and an inner surface as part of the central support rib which extends upwardly from and substantially perpendicular to the floor, the inner surface being in transition with an inner beveled surface which is part of the central support rib which projects towards the axial centerline of the housing, the intersection of the inner surface and the inner beveled surface defining a corner, the cavity periphery further including an outer surface as part of the sidewall which extends upwardly from and substantially perpendicular to the floor, the outer surface being in transition with an outer beveled surface as part of the sidewall which projects away from the axial centerline of the housing;
- and
- a plurality of terminals, each having a flared portion which lies flush with the outer beveled surface, the flared portion in transition with a first contact portion disposed flushly against the outer surface, the first contact portion in transition with a first reversely bent portion adjacent to the floor thereafter extending a terminal portion upwardly and into a second reversely bent portion which projects a diagonal portion downwardly and into a second contact portion which is in a preloaded condition against the fist contact portion, the upwardly extending terminal portion being in a contacting relation with the corner, the terminal further comprising a tail portion, struck from an interior of the upwardly extending terminal portion, and projecting through the aperture in the floor for interconnection to a printed circuit board.
An electrical socket for interconnecting an integrated circuit package thereto and for decoupling said package, the integrated circuit package including a package body and a plurality of leads extending therefrom, the leads disposed in two parallel rows along said package, the socket comprising;
- a housing means having a plurality of contact receiving cavities therein opening up to a package receiving face, the cavities being disposed in two parallel rows and spaced as said package leads;
- a capacitor assembly including a capacitor means and at least two contact members, the contact members having a printed circuit board interconnection portion extending through an aperture in a floor of said cavity and extending below said housing means, the contact members further including contacting portions profiled for receipt in two of said contact receiving cavities and contacting said package leads upon insertion of said package leads therein, the contact members further including plate means integral with said contacting portions and upstanding above said package receiving face, the capacitor means being mechanically mounted and electrically connected to said plate means.
An electrical socket for electrically connecting an integrated circuit package thereto, the package including a body portion and a lead frame portion having a plurality of leads all of which extend from one side edge of the body portion, the leads formed into two parallel rows with every other lead staggered, the socket comprising:
- an insulative housing having axially extending sidewalls, endwalls and a central support rib which extends along the axial centerline of the housing, the housing having two parallel rows of contact receiving cavities opening into an upper package receiving face, each row of cavities being on opposite sides of the central support rib, the cavities in a first row being axially staggered from the cavities in a second row, the lateral centerlines of the cavities in the first row being equally spaced between the lateral centerlines of adjacent cavities in the second row, the cavities being further defined by cavity walls which are transverse to the central support rib and laterally spaced to define the staggered cavities, the periphery of each cavity being defined by a floor having an aperture extending therethrough, and an inner surface as part of the central support rib which extends upwardly from the floor, the cavity periphery further including an outer surface as part of the sidewall which extends upwardly from and substantially perpendicular to the floor, the outer surface being in transition with an outer beveled surface as part of the sidewall which projects away from the axial centerline of the housing;
- and
- a plurality of terminals having a flared portion which lies flush with the outer inclined surface, the flared portion being in transition with a first contact portion disposed flushly against the outer surface, the first contact portion being in transition with a first reversely bent portion adjacent to the floor thereafter extending a terminal portion upwardly and into a second reversely bent portion which projects a diagonal portion downwardly and into a second contact portion which is in a preloaded condition against the first contact portion, the upwardly extending terminal portion being diagonally disposed within the cavity away from the first contacting portion to space the second reversely bent portion therefrom, the terminal further comprising a tail portion, struck from an interior of the upwardly extending terminal portion, and projecting through the aperture in the floor for interconnection to a printed circuit board.
Dependencies are inferred from the claim text.