US 4,711,858 AGranted

Method of fabricating a self-aligned metal-semiconductor FET having an insulator spacer

AssigneeInternational Business Machines Corporation

InventorsChristoph S. Harder, Heinz Jaeckel, Hans P. Wolf

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Abstract

A method for the fabrication of self-aligned MESFET structures with a recessed refractory submicron gate. After channel formation on a semi-insulating (SI) substrate, which may consist of a III-V compound semiconductor such as GaAs, with subsequent annealing, refractory gate material is deposited and patterned. This is followed by the overgrowth of a highly doped contact layer of, e.g., GaAs, using MOCVD of MBE processes resulting in poly-crystalline material over the gate "mask" and mono-crystalline material on exposed semiconductor surfaces. Next, the poly-crystalline material is removed in a selective etch process, this step being followed by the deposition of source and drain electrodes. In order to further improve process reliability, insulating sidewalls are provided at the vertical edges of the gate to avoid source-gate and drain-gate shorts.

Claims10

Dependent claims

A method of fabricating a self-aligned metal-semiconductor field effect transistor, the transistor being formed on a semi-insulating semiconductor substrate and comprising a current channel and associated source, gate and drain electrodes, characterized in that it comprises the following steps:

forming an active channel layer at the surface of said semiconductor substrate,
depositing a refractory metal gate layer over said substrate surface,
selectively etching said gate layer to form said gate electrode,
depositing a thin dielectric layer over said gate electrode and over said substrate surface,
etching said dielectric layer so as to form an insulating sidewall layer on the vertical ediges of said gate electrode,
forming a highly doped continuous semiconductor contact layer over said substrate surface, over said gate electrode and over said insulating sidewall layer, said contact layer being mono-crystalline material over said substrate surface and poly-crystalline material over said gate electrode and over said insulating sidewall layer,
removing said poly-crystalline material, and
depositing and selectively etching a metal layer over said mono-crystalline material to form said source and said drain electrodes.

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Dependencies are inferred from the claim text.