Wafer probe

A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising:

• a transmission line assembly having a probe board and having a metallic signal conductor and a metallic ground conductor deposited in a coplanar fashion on the probe board;
• and
• a body of selected microwave absorbing material having substantial thickness adjacent the transmission line assembly;
• said body of selected microwave absorbing material being tapered from a wider dimension to a narrower dimension proximate said small planar device.

A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising:

• a transmission line assembly having a probe board, at least one metallic signal conductor and one more than an equal number of metallic ground conductors, the signal and ground conductors being deposited alternately in a coplanar fashion on one side of the probe board;
• a metallic channel attached to the ground conductors and spanning, but not touching, the at least one signal conductor;
• and
• selected microwave absorbing material generally surrounding the transmission line assembly.

A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductor wafer, comprising:

• a transmission line assembly, having a probe board, and having a metallic signal conductor and a metallic ground conductor deposited on the probe board;
• wherein the metallic ground and signal conductors form a transmission line extending from the selected points on the planar device to points of connection with the electrical test equipment, the ground and signal conductors being sized and juxtaposed such that the transmission line has a constant characteristic impedance throughout its length;
• and
• selected microwave absorbing material positioned near the transmission line ground conductor.

A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising:

• a transmission line assembly having a probe board, with a top and a bottom side, and having a metallic signal conductor and a metallic ground conductor deposited in a coplanar fashion on the bottom side of the probe board;
• and
• selected microwave absorbing material positioned above and near the top side of the probe board,
• wherein the probe board is trapezoidal-shaped and the microwave absorbing material comprises a tapered layer mounted on, and generally coextensive with, the top of the probe board.

A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising:

• a transmission line assembly having a probe board, at least one metallic signal conductor and one more than an equal number of metallic ground conductors, the signal and ground conductors being deposited alternately in a coplanar fashion on one side of the probe board;
• a metallic channel attached to the ground conductors and spanning, but not touching, the at least one signal conductor;
• and
• selected microwave absorbing material generally surrounding the transmission line assembly, wherein the microwave absorbing material comprises iron.

A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising:

• a transmission line assembly having a probe board, at least one metallic signal conductor and one more than an equal number of metallic ground conductors, the signal and ground conductors being deposited alternately in a coplanar fashion on one side of the probe board;
• a metallic channel attached to the ground conductors and scanning, but not touching, the at least one signal conductor;
• and
• selected microwave absorbing material generally surrounding the transmission line assembly, wherein the microwave absorbing material comprises ferrite.

A probe for connecting electrical test equipment to selected points on a small planar device on a semiconductive wafer, comprising:

• a transmission line assembly having a probe board, at least one metallic signal conductor and one more than an equal nmber of metallic ground conductors, the signal and ground conductors being deposited alternately in a coplanar fashion on one side of the probe board;
• a metallic channel attached to the ground conductors and spanning, but not touching, the at least one signal conductor;
• and
• selected microwave absorbing material generally surrounding the transmission line assembly;
• wherein the probe board is trapezoidal-shaped and the microwave aborbing material tapers with the probe board.

A probe for connecting electrical test equipment to selected points on a small electrical component, said probe comprising:

• a transmission line assembly having a probe board and having a metallic signal conductor and a metallic ground conductor spaced on the probe board;
• and
• selected microwave absorbing material positioned near the transmission line ground conductor;
• wherein the probe board is trapezoidal-shaped and the microwave absorbing material comprises a tapered layer mounted on, and generally coextensive with, the probe board.