Air cooling assembly in an electronic system enclosure

In an electronic systems enclosure, an air cooling apparatus comprising:

• a cabinet having an upper wire rack and a lower wire rack, each of said upper and lower wire racks having spaced apart, parallel rods;
• a plurality of logic module cassettes, each logic module module cassette having a vertical member slideably fit between said upper and lower wire racks and including an upper glide member on the vertical member having guide means movably engaged with two of the parallel rods of said upper wire rack and a lower glide member on the vertical member having guide means movably engaged with two of the parallel rods of said lower wire rack so that each of said logic module cassettes slides between corresponding parallel rods of said upper and lower wire racks;
• said upper and lower glide members having opening means therethrough for allowing cooling air to move through the opening means of the upper and lower guide members such that cooling air may move through each of said logic module cassettes;
• fan means in the upper portion of said cabinet above said upper wire rack for drawing cooling air upwardly through said logic module cassettes;
• and
• a module filler means having the same dimensions as one of said logic module cassettes,
• said module filler means slideably located between said upper and lower wire racks and blocking cooling air flow so that blocked cooling air is diverted by said module filler means to flow through said logic module cassettes.