Induced flow heat exchanger
AssigneeAT&T Information Systems Inc.
InventorKevin J. Kennedy
Life of this patent
Estimating the term…
Abstract
In order to cool heat generating components on an electronic assembly without contamination by particles carried in a cooling gas stream, a cold plate is disposed adjacent the assembly, defining a gap region therebetween. The cooling gas is directed in proximity to the cold plate, dissipating heat transferred from the components to the plate. To enhance overall heat dissipation of the apparatus, an aperture is defined between the gap region and the gas stream, so that a negative pressure is induced in the gap by virtue of the Bernoulli principle. This pressure difference induces convection within the gap, increasing heat flow between the components and the plate, and resulting in overall improvement in heat dissipation. Embodiments in which the gas stream flow is parallel and transverse to the cold plate are described.
Claims12
Apparatus including
- an electronic assembly which includes heat generating elements,
- a heat conductive cooling plate disposed in a generally parallel direction relative to said electronic assembly, said cooling plate having first and second sides, said first side disposed adjacent to said electronic assembly and defining a gap between said plate and said assembly, and
- means for generating a moving stream of cooling gas adjacent to said second side of said cooling plate,
- wherein said cooling plate defines an aperture which permits communication between said gas stream and said gap,
- whereby a convection current within said gap and gas flow out of said aperture is induced by passage of said gas stream over said aperture.
Apparatus for cooling heat generating elements, including
- means for maintaining said heat generating elements in a generally planar array,
- a heat conductive cooling plate having first and second surfaces,
- means for disposing said first surface adjacent and generally parallel to said maintaining means to define a generally closed air gap between said plate and said assembly, and
- means for generating an air stream adjacent to said second surface of said cooling plate which communicates with said air gap via an aperture defined by said cooling plate,
- whereby a convection air current within said gap and out of said aperture is induced by passage of said air stream over said aperture.
Apparatus comprising
- an electronic assembly including heat generating elements,
- a heat conductive cold plate,
- housing means for disposing a first side of said cold plate in spaced parallel relation to a surface of said electronic assembly, said housing and said plate together defining a generally closed gap region, and
- means for generating a gas stream adjacent to a second side of said cooling plate,
- wherein said cold plate defines an aperture permitting communication between said gas stream and said gap region,
- whereby a convection current within said gap and exiting from said aperture is induced by passage of said gas stream over said aperture.
Apparatus comprising
- a circuit board containing heat generating elements,
- a cold plate constructed of a heat conductive material,
- means for positioning a first side of said cold plate in parallel relation to a major surface of said circuit board, said housing and said plate together defining a gap region therebetween, and
- means for generating an air stream in parallel relation to a second side of said cooling plate,
- wherein said cold plate defines an aperture communicating between said air stream and said air gap region, so that a convection air current within said gap and out of said aperture is induced by passage of said air stream over said aperture,
- whereby heat transfer between said heat generating elements and said cold plate is enhanced.
Apparatus for cooling an electronic assembly which includes heat generating elements, comprising
- a heat conductive cooling plate having first and second sides, said first side disposed adjacent to said electronic assembly and defining a gap between said plate and said assembly, said cooling plate defining an aperture which permits communication between a generated stream of cooling gas and said gap, and
- means for generating said gas stream, said means arranged to induce a convection current within said gap and gas flow out of said aperture by passage of said cooling gas stream adjacent to said second side of said cooling plate and over said aperture.
Apparatus for cooling an electronic assembly which includes heat generating elements, comprising
- a heat conductive cooling plate having first and second sides, said first side disposed adjacent to said electronic assembly and defining a gap between said plate and said assembly,
- means for generating a stream of cooling gas adjacent to said second side of said cooling plate, and
- means for inducing a convection current within said gap, said inducing means including an aperture defined by said cooling plate permitting communication between said gas stream and gas in said gap so that passage of said cooling gas stream adjacent to said second side of said cooling plate and over said aperture creates a negative pressure differential in said aperture.
Dependencies are inferred from the claim text.