Component lead processor trimming and forming tool

Abstract

There is provided a device which is principally used for trimming to a predetermined length the leads on electronics components prior to their insertion and connection to a printed circuit board. The device comprises a housing, in which is disposed positioning means and a movable plunger to which is attached a cutter blade. Also in contact therewith are resilient urging means to maintain close contact for effective shear cutting between the cutter blade and a die removably, but in fixed position, attached to the housing. The die incorporates holes or perforations into which the component leads are inserted for trimming, a plurality of holes normally being utilized in positions that correspond to the position of such leads on said component. The die is also a predetermined thickness, which thickness establishes the lengths to which the leads are trimmed in accordance with the specifications and thickness of the PC board to which the component will subsequently be soldered. The holes or perforations in the die will preferably be staggered or disposed in an angular orientation to the linear motion of the cutter blade with respect to the die such that each component lead will be severed in an identical angle, and in timed sequence to equalize the pressure required to do so throughout the stroke of the cutter blade.

Dependencies are inferred from the claim text.