Heat treatment machine for semiconductors
OwnerDuy-Phach Vu, Michel Haondinventors
Life of this patent
Estimating the term…
Abstract
A heat treatment machine for heat-treating semiconductor wafers, each wafer having two faces. A first lamp is arranged to heat a first spot of first diameter on one face of the wafer and a second lamp is arranged to heat a second spot of second diameter on the other face of the wafer, both by reflection of emitted light off a focusing reflector. The lamps are moved in tandem such that the first spot travels along an Archimedes spiral relative to the center of the stationary wafer. The centers of the spots coincide, and the second diameter is greater than the first diameter.
Claims11
A heat treatment machine for heat treating a semiconductor wafer having first and second faces, comprising a first heating means arranged to locally heat a first spot on said first face of said wafer, a second heating means arranged to locally heat a second spot on said second face of said wafer, and means for displacing said first and second heating means such that said first spot scans the entire area of said first face, wherein said first spot forms a circle of first diameter and said second spot forms a circle of second diameter, said second diameter being greater than said first diameter and said first and second spots having a common center.
Dependencies are inferred from the claim text.