Target bonding process
AssigneeGTE Products Corporation
InventorsHenry Hidler, Ernest Davey, Lawrence L. Hope, Robert Shimer
Life of this patent
Estimating the term…
Abstract
A process for bonding one or more target parts, such as yttrium oxide target parts, to a copper backing plate to provide improved mechanical support and improved heat transfer. The process is one in which a noble metal, preferably platinum, is applied to the target to provide an oxide free layer to which indium/lead solder joins. The solder step is performed so that contamination by flux or by formation of an oxide is prevented.
Claims11
A process for bonding a sputtering target to a heat conductive backing plate for subsequent use in a sputtering operation, said process comprising the steps of:
- applying a substantially oxide-free noble metal layer over one side of said sputtering target, said step of applying the noble metal layer comprising providing the noble metal in an organometallic paint, applying said paint to said sputtering target, heating said sputtering target to drive off organics and leave substantially only the noble metal as a layer covering at least a part of said sputtering target;
- applying a first solder layer to a specific area of said backing plate;
- removing traces of flux used in applying said first solder;
- maintaining said backing plate and said sputtering target in a dry atmosphere;
- applying a second solder layer over said noble metal layer on said sputtering target and maintaining said second solder layer soft;
- and
- heating said first solder layer on said backing plate and joining said first solder layer on said backing plate and said second solder layer on said sputtering target to form a combination solder and noble metal layer as a bond between said sputtering target and said backing plate.
Dependencies are inferred from the claim text.