US 4,542,784 A · Retention and cooling of plug-in electronic modules in a high shock and vibration environment

Abstract

Method and apparatus are disclosed for selectively clamping the edges of electronic modules into mechanical and thermal contact with a fluid coolant circuit. A stack of plural substantially parallel and generally planar fluid conduit-containing structures having spaced apart parallel legs jointly receive a stack of plural generally planar electronic modules disposed transversely therewithin. Each of the fluid conduit-containing structures includes mechanical/thermal contact pads disposed approximately perpendicular to its general plane on the inside edges of the parallel legs with the pads on some of the structures being directed one way and those on others of the structures being directed in an opposite way. At least one such set of structures is then collectively moved so as to selectively clamp the edges of the stack of electronic modules between opposingly directed contact pads. A special type of fluid conduit-containing structure formed by bonding two or more elongated sheets of spring metal along the boundaries of mating indentations is preferably employed with at least portions along one edge of the bonded sheets comprising the structure being oppositely bent up into individual and/or into pairs of spring pads to realize the contact pads just discussed.

Claims10

Dependent claims

Method for selectively clamping the edges of an array of plural electronic modules into mechanical and thermal contact with a fluid coolant circuit, said method comprising the steps of:

providing a stack of plural substantially parallel generally planar fluid conduit-containing structures having spaced-apart legs, each said structure having mechanical/thermal contact pads disposed approximately perpendicular to its general plane on the inside edges of said parallel legs, said contact pads being directed in one direction on some of said structures and in an opposite direction on others of said structures;
moving at least said some structures in a first direction so as to permit unobstructed insertion of a stack of electronic modules transversely of said structures with the module edges being disposed between said opposingly directed contact pads;
and
moving at least said some structures in a second direction opposite said first direction to selectively clamp the edges of said stack of electronic modules between said opposingly directed contact pads.

1 more element

A method for releasably retaining an array of plural electronic modules in thermal and mechanical contact with a frame structure including conduit for passage of a fluid coolant, said method comprising the steps of:

providing a first plurality of substantially parallel clamp members, each having an included fluid coolant conduit and plural spaced-apart projecting tabs directed in a first direction,
providing a second plurality of substantially parallel clamp members, each having an included fluid coolant conduit and plural spaced-apart projecting tabs directed in a second direction generally opposite to said first direction, at least one of the plurality of clamp members being capable of reciprocating movement along said first and second directions, the individual clamp members of said first and second plurality of clamp members being interleaved with one another and defining channels between their corresponding but oppositely directed projecting tabs for receiving the edges of respective electronic modules;
collectively moving at least one of said first and second pluralities of clamp members away from the other to permit insertion and withdrawal of electronic modules along said channels;
and
collectively moving at least one of said first and second pluralities of clamp members toward the other to mechanically and thermally clamp the edges of electronic modules located within said channels between their oppositely directed projecting tabs.

2 more elements

Dependencies are inferred from the claim text.

Retention and cooling of plug-in electronic modules in a high shock and vibration environment

Life of this patent

Retention and cooling of plug-in electronic modules in a high shock and vibration environment

Life of this patent

Abstract

Claims10