Surface metallized semiconductors
AssigneeBayer Aktiengesellschaft
InventorsKirkor Sirinyan, Rudolf Merten, Gerhard D. Wolf, Henning Giesecke, Uwe Claussen, Harold Ebneth
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Abstract
The firmly adhesive metallization, in particular partial metallization, of the surface of semiconductors is possible, without pickling, by carrying out the activation with organometallic compounds of metals of the I and VIII Secondary Groups of the Periodic Table of Elements, then reducing in a conventional manner and metallization without current.
Claims3
Semiconductors metallised on the surface, characterised in that the metal layer is applied, without previous pickling, by activating with organometallic compounds of metals of Groups IB and VIII of the Periodic Table of Elements, by reduction and currentless wet-chemical metallisation.
Dependencies are inferred from the claim text.