Self-positioning heat spreader

A heat spreader adapted for insertion into a mold cavity prior to encapsulation thereof for conducting heat away from a metal lead frame and configured to minimize capacitance between the heat spreader and the lead frame, said heat spreader being substantially parallel to a first surface of the metal lead frame having a semiconductor die mounted on a first portion of the lead frame and connected to a second surface of the lead frame, the heat spreader comprising:

• a heat conductive frame having first and second notches formed in opposite ends thereof to define bifurcated limbs sized to extend into within a first predetermined tolerance of first and second end walls of said cavity, with inner edges of each such limb tapering to a predetermined one of the end walls and complementing a second portion of the lead frame which will overlay the limb when encapsulated to minimize said capacitance, at least a pair of spaced-apart lateral standoffs extending from each of first and second sides into within a second predetermined tolerance of first and second side walls of said cavity, at least a pair of spaced-apart feet extending a predetermined distance from a lower surface thereof;
• and
• a solid central portion adjacent said notches and extending to within a third predetermined tolerance of the first surface of the portion of said lead frame on which said die is mounted when encapsulated, whereby said first, second and third predetermined tolerances are selected so that said heat spreader is self-positioning with respect to said mold cavity and said lead frame.