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US 4,541,004 AGranted
Aerodynamically enhanced heat sink
AssigneeBurroughs Corporation
InventorRichard M. Moore
Life of this patent
Estimating the term…
Abstract
An aerodynamically enhanced heat sink is disclosed, which heat sink includes a plurality of metallic pins each having one end thereof affixed to the integrated circuit package and the second end thereof being disposed for heat dissipation. The plurality of pins are made of varying lengths such that a partial hemisphere is formed with the second ends thereof.
Claims5
A heat sink for cooling an integrated circuit package, said heat sink comprising:
- a plurality of metallic pins each having one end thereof attached to the integrated circuit package and the second end thereof being disposed for heat dissipation, said plurality of pins being of varying lengths such that a partial hemisphere is formed with the second ends thereof.
Dependencies are inferred from the claim text.