Photoresists suitable for forming relief structures of highly heat-resistant polymers
AssigneeMerck Patent GmbH
InventorsRudolf Klug, Hartmut Hartner, Hans-Joachim Merrem, Karl H. Neisius
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Abstract
Photoresists suitable for use for forming relief structures of highly heat-resistant polymers and which contain soluble polymeric precursors which carry radiation-reactive radicals bonded through carboxylic ester groups have an increased light-sensitivity when they also contain at least one radiation-reactive, polymerizable allyl compound which has a boiling point above 180.degree., the allyl group thereof being bonded via an oxygen, sulfur and/or nitrogen atom. The highly heat-resistant polymers which can be prepared by means of these photoresists have excellent chemical, electrical and mechanical properties.
Claims21
In a photoresist comprising a soluble polyamide-ester prepolymer containing radiation-reactive radicals bonded to the repeating unit of the prepolymer through carboxylic ester linkages;
- said amide having the structure of the reaction product of a carboxylic aid and an amine, the improvement wherein said photoresist further comprises at least 3% by weight, relative to the weight of said soluble prepolymer, of at least one radiation-reactive polymerizable allyl compound having a boiling point above 180.degree. C., the allyl groups thereof being bonded through an oxygen, sulfur or nitrogen atom.
In a process for forming relief structures of highly heat-resistant polymers, comprising the steps of applying a photoresist comprising a soluble polyamide-ester prepolymer containing radiation-reactive radicals bonded to the repeating unit of the prepolymer through carboxylic ester linkages, said amide having the structure of the reaction product of a carboxylic acid and an amine, said photoresist being applied in the form of a layer or sheet to a substrate, drying the layer or sheet, irradiating the dried, radiation-sensitive layer or sheet through a negative original or using a guided collimated beam, dissolving out or stripping off the non-irradiated portions of the layer or sheet to form a relief structure, the improvement wherein said photoresist further comprises at least 3% by weight, relative to the weight of said soluble prepolymer, of at least one radiation-reactive polymerizable allyl compound having a boiling point above 180.degree. C., the allyl groups thereof being bonded through an oxygen, sulfur or nitrogen atom.
A method of reducing the irradiation time of a photoresist comprising a soluble polyamide-ester prepolymer containing radiation-reactive radicals bonded to the repeating unit of the prepolymer through carboxylic ester linkages, said amide having the structure of the reaction product of a carboxylic acid and an amine, comprising incorporating in said photoresist at least 3% by weight, relative to the weight of said soluble prepolymer of at least one radiation-reactive polymerizable allyl compound having a boiling point above 180.degree. C., the allyl groups thereof being bonded through an oxygen, sulfur or nitrogen atom.
Dependencies are inferred from the claim text.