Process for the development of relief structures based on radiation-crosslinked polymeric precursors of polymers which are resistant to high temperature
AssigneeMerck Patent GmbH
InventorsHans-Joachim Merrem, Karlheinz Neisius, Rudolf Klug, Hartmut Hartner
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Abstract
An improved development process for relief structures based on radiation-crosslinked polymeric precursors of polymers which are resistant to high temperature in which the development fluid used is an aliphatic or cycloaliphatic ketone having 3 to 7 carbon atoms, is distinguished by rapid and complete removal of soluble polymeric material from the substrate with, at the same time, a minimum amount of attack on the radiation-crosslinked polymeric structures.
Claims12
In a process for forming relief structures convertible to heat-resistant polyimide polymers, comprising the steps of applying a photoresist comprising a soluble polyimide precursor containing radiation-reactive radicals, said photoresist being applied in the form of a layer or sheet to a substrate, drying the layer or sheet, irradiating the dried, radiation-sensitive layer or sheet through a negative original or using a guided collimated beam, dissolving out the non-irradiated portions of the layer or sheet using a developer fluid to develop a relief structure,
- the improvement wherein said developer fluid consists essentially of a C.sub.3-7 -aliphatic or C.sub.3-7 -cycloaliphatic ketone;
- whereby said non-irradiated portions are rapidly removed with minimal erosion and swelling of the crosslinked layer, and the safety margin in the development time can be significantly increased.
Dependencies are inferred from the claim text.