Resist material and process for forming fine resist pattern

A resist material coated on a substrate, wherein portions of the material are irradiated and developed to form a pattern, which comprises a copolymer of a fluoroalkyl acrylate having the general formula (I):

• ##STR8## wherein R.sub.1 is methyl group, ethyl group, a halogen-substituted methyl or ethyl group, a halogen atom or hydrogen atom, R.sub.2 is a bivalent hydrocarbon group having 1 to 6 carbon atoms, and R.sub.f is a fluoroalkyl group having 1 to 15 carbon atoms,
• and an acrylic comonomer selected from the group consisting of a glycidyl acrylate having the general formula (II):
• ##STR9## wherein R.sub.3 is hydrogen atom, methyl group or ethyl group, an acrylic acid having the general formula (III):
• ##STR10## wherein R.sub.3 is as defined above, an acrylamide having the general formula (IV):
• ##STR11## wherein R.sub.3 is as defined above, and an .alpha.-cyanoacrylate having the general formula (V):
• ##STR12## wherein R.sub.4 is hydrogen atom or alkyl group having 1 to 5 carbon atoms and wherein the ratio of the fluoroalkyl acrylate (I) to the acrylic comonomer is from 60:40 to 99.9:0.1 by mole.