High power semiconductor package

A high power semiconductor package comprising:

• a unitary extruded-metal housing having a long axis, and having a bottom plate having ends, first and second end walls upstanding from the bottom plate and spaced from each other along the long axis and from the ends of the bottom plate defining open side walls and an open planar top, the ends of the bottom plate including means for mounting the housing to a mounting surface;
• the housing including a plurality of anchor elements integrally formed on the end walls and on the bottom plate;
• first and second electrical terminals disposed in the housing in spaced-apart relation along the long axis, each having an outer end protruding from the planar top of the housing and by which external electrical connection is made, and an inner end within the housing in spaced relation to the bottom of the housing;
• first and second semiconductor die assemblies, each mounted in spaced-apart relation along the long axis of the housing and mechanically adjacent the inner ends of the first and second electrical terminals on the bottom plate and each including a power semiconductor device;
• each of the electrical terminals including a first conductive post;
• means for electrically connecting the first posts of said first and second electrical terminals to respective ones of said first and second semiconductor die assemblies;
• and
• an encapsulant disposed in the housing between the upstanding walls thereof, the encapsulant being secured by the anchor elements of the housing.

A high power semiconductor package, comprising:

• a unitary extruded-metal housing a bottom plate having ends, first and second end walls upstanding from the bottom plate and spaced from each other and from the ends of the bottom plate defining open sidewalls and a planar open top, the ends of the bottom plate including means for mounting the housing to a mounting surface;
• the housing including a plurality of anchor elements integrally formed on and outwardly extending from at least one of said end walls and formed on the bottom plate;
• first, second, and third electrical terminals disposed in the housing, each having an outer portion protruding from the housing and by which external electrical connection is made, and an inner end within the housing in spaced relation to the bottom plate of the housing;
• at least one conformal electrically insulating plate disposed on the bottom plate of the housing;
• an electrically conductive strap disposed on the insulating plate and extending beneath each of the electrical terminals;
• first and second semiconductor die assemblies, each mounted in spaced-apart relation on the conductive strap and each including a power semiconductor device;
• said first and second terminals each including a first conductive post on its inner end electrically connected to a respective one of said first and second die assemblies;
• said third terminal including a conductive post connected to the conductive strap;
• and
• an encapsulant disposed in the housing between the upstanding walls thereof, the encapsulant being secured by the anchor elements of the housing.