High power chip cooling device and method of manufacturing same
AssigneeInternational Business Machines Corporation
InventorPaul Kok
Life of this patent
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Abstract
A leaf-type cooling device for coupling a semi-conductor chip package to a heat sink is formed by accordion pleated folding of two copper strips coated on their non-mating sides with solder and their mating sides with polysulfone and then using heat to solder the non-mating surfaces of strip folds together and the ridges defined by the folds to respective opposed solderable supports. The polysulfone adhesive is thereafter removed by solvation to form interleaved fins between the supports. Springs function to bias the supports away from each other.
Claims8
A method of making a leaf-type cooling device for semiconductor chip packages, said method comprising the steps of:
- removably laminating two strips of a heat transfer metal together back-to-back with a solvent soluble adhesive to form a composite strip;
- coating the non-mating exposed planar surfaces of said composite strip with a solder;
- folding said composite strip in accordion pleated fashion with compacted folds in abutment with one another and forming ridges at the fold lines thereof;
- positioning said folded composite strip between solderable supports having the opposed faces of said supports in contact with respective opposed ridges of said folded composite strip;
- heating said composite strip to solder said ridges to respective ones of said supports and to solder adjacent folds of the same strip to each other;
- and
- removing said adhesive by solvation in a solvent to form interleaved fins between said supports.
A leaf-type cooling device for semiconductor chip packages manufactured in accordance with the method comprising the steps of:
- removably laminating two strips of a heat transfer metal together back-to-back with a solvent soluble adhesive to form a composite strip;
- coating the non-mating exposed planar surfaces of said composite strip with a solder;
- folding said composite strip in accordion pleated fashion with compacted folds in abutment with one another and forming ridges at the fold lines thereof;
- positioning said folded composite strip between solderable supports having opposed faces of said supports in contact with respective opposed ridges of said folded composite;
- heating said composite strip to solder said ridges to respective ones of said supports and to solder adjacent folds of the same strip to each other;
- and
- removing said adhesive by solvation in a solvent to form interleaved fins between said supports;
- thereby producing a low cost, low impedance heat transport device of a minimal number of components which may be subject to standard stamping and forming operations.
Dependencies are inferred from the claim text.