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US 4,506,108 AGranted
Copper body power hybrid package and method of manufacture
AssigneeSperry Corporation
InventorsDennis R. Kersch, Don E. Mitchell
Life of this patent
Estimating the term…
Abstract
A hybrid microcircuit package especially for high power microcircuits comprises a hard copper base with integral packaged sidewalls, a sealing frame of Kovar or stainless steel is electron beam welded or laser welded to the top surface of said sidewalls, whereby to highly localize the high temperature at the wall tops and not anneal to the remainder of the copper base. A Kovar or stainless steel lid is conventionally sealed to the frame.
Claims13
A high power hybrid microcircuit package comprising
- (a) a base member having a bottom and upstanding side walls together defining an interior volume, said base member being fabricated from a metallurgically hard, elastic, high thermally conductive copper,
- (b) a seal ring on the top surface of said side walls, said seal ring having fabricated from a low thermal conductivity weldable metal, said seal ring being welded to said side wall tops by highly localized thermal weld whereby to avoid annealing of said hard copper base member,
- (c) a plurality of conductor leads extending through said side walls and having seal members brazed to said side walls, and
- (d) a top lid on said seal ring, said lid being fabricated from a low thermal conductivity metal and being resistance welded to said seal ring.
1 more element
The method of manufacturing a high power hybrid microcircuit package consisting in
- welding a seal ring to the top walls of a metallurgically hard, elastic, high thermally conductive copper base member having upstanding sidewalls together defining an interior volume, said welding being accomplished such that the temperature of only the top edges of said sidewalls exceeds the annealing temperature of said copper whereby the temperature of the remainder of said sidewalls and said bottom does not exceed said annealing temperature.
Dependencies are inferred from the claim text.