Pressure sensitive adhesive composition
AssigneeKanegafuchi Kagaku Kogyo Kabushiki Kaisha
InventorsToshifumi Hirose, Katsuhiko Isayama
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Abstract
A pressure sensitive adhesive composition comprising (A) a polyether having at least one silicon-containing hydrolyzable group, having an average molecular weight of 300 to 30,000 and having a principal chain which is essentially constructed with the chemically bonded recurring units: --R.sup.1 --O-- wherein R.sup.1 is a divalent alkylene group and (B) a tackifier; said tackifier being admixed with the polyether in an amount of 10 to 140 parts by weight per 100 parts by weight of said polyether. From the composition a pressure sensitive adhesive product having good adhesive properties can be prepared substantially without a solvent.
Claims7
A pressure sensitive adhesive composition comprising (A) a polyether having at least one silicon-containing hydrolyzable group, having an average molecular weight of 300 to 30,000 and having a principal chain which is essentially constructed with the chemically bonded recurring units:
- --R.sup.1 --O--
- wherein R.sup.1 is a divalent alkylene group and (B) a tackifier;
- said tackifier being admixed with the polyether in an amount of 10 to 140 parts by weight per 100 parts by weight of said polyether.
Dependencies are inferred from the claim text.