High temperature positive diazo photoresist processing using polyvinyl phenol
AssigneeShipley Company, L.L.C.
InventorsGeorge J. Cernigliaro, Charles R. Shipley
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Abstract
This invention is for a photoresist capable of withstanding temperatures in excess of 200.degree. C. without image distortion. The photoresist comprises a high temperature diazo sensitizer, preferably an ester or amide of an o-quinone diazide sulfonic or carboxylic acid chloride, in a binder comprising a polyvinyl phenol. The sensitizer and polyvinyl phenol react with each other at elevated temperature. The sensitizer has a secondary decomposition temperature and the polyvinyl phenol has a flow temperature at least equal to the temperature where reaction between the two occurs.
Claims17
A process for increasing the photoresist distortion temperature of a photoresist film comprising a high temperature, positive working diazo sensitizer and a resin system of a thermoplastic polyvinyl phenol to in excess of the flow temperature of the polyvinyl phenol and in excess of 200.degree. C., said sensitizer having a secondary decomposition temperature and said polyvinyl phenol having a flow temperature in excess of 200.degree. C. and in excess of the temperature at which reaction occurs between the two, said process comprising the steps of exposing said film to activating radiation in an image pattern, developing said film and heating said film to a temperature in excess of 200.degree. C. and for a time at least sufficient to cause reaction to occur between said sensitizer and said polyvinyl phenol, said heating step occuring during or subsequent to imaging.
Dependencies are inferred from the claim text.