Process for preparing particle board
AssigneeThe Upjohn Company
InventorsSteven B. Lowenkron, Richard A. Prather, Howard R. Steele
Life of this patent
Estimating the term…
Abstract
Particle boards are currently prepared by treating the particles (e.g. wood chips) with a binder comprising an organic polyisocyanate and, optionally, a release agent and then subjecting the treated particles to a molding process involving heat and pressure. The resulting particle board will generally release well from the caul plates of the press after forming. However, it has been found that the ease of release is enhanced, particularly where the wood particles in the board are derived from hardwood, by utilizing a metal selected from magnesium and zinc in the metallic surfaces of the caul plates or platens which come into contact with the particle board during the application of heat and pressure.
Claims9
In a process for the preparation of particle board wherein particles of material capable of being compacted are contacted with a polyisocyanate binder and the treated particles are subsequently molded into boards by the application of heat and pressure utilizing metal caul plates or platens, the improvement which comprises employing, as the metallic surfaces which come into contact with said particle board during said application of heat and pressure, a metal selected from the group consisting of magnesium and zinc.
In a process for the preparation of particle board wherein particles of material capable of being compacted are contacted with a polyisocyanate binder and the treated particles are subsequently molded into boards by the application of heat and pressure utilizing metal caul plates or platens, the improvement which comprises employing caul plates fabricated from magnesium in said application of heat and pressure.
Dependencies are inferred from the claim text.