Method of detecting and analyzing damage in printed circuit boards

A method of detecting and analyzing flaws in a printed circuit board laminate having metallized circuit lines and lands and drilled holes comprising:

• applying a penetrating solution containing multifunctional methylacrylates and a UV fluorescing dye to said circuit board laminate to fill drilled holes and flaws therein, said penetrating solution being capable of being polymerized;
• removing excess penetrating solution from the drilled holes and the surface of said circuit board laminate;
• curing the penetrating solution remaining in the flaws into an insoluble solid;
• cross-sectioning the circuit board laminate to provide at least one sample carrying the cured solution;
• encapsulating the sample in a clear epoxy;
• grinding and polishing said encapsulated sample to provide a surface to be examined;
• examining said surface under UV light;
• and
• photographing said surface to be examined under both UV light and regular light to make a record showing the nature and location of the flaws which fluoresce and also the metallized circuit lines and lands which do not fluoresce.