Process for nickel plating aluminum and aluminum alloys
AssigneeLea-Ronal, Inc.
InventorsRichard B. Kessler, Fred I. Nobel
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Abstract
A process for the electrolytic or electroless deposition of a coating of nickel on an aluminum or aluminum alloy substrate which comprises immersing the substrate in a hydroxide solution having a pH of about 12 or above, a nickel or cobalt compound soluble therein and a non-cyanide complexing agent for the nickel or cobalt compound capable of maintaining the nickel or cobalt metal in solution at a pH of about 12 or above, and electrolytically or electrolessly coating a layer of nickel thereon.
Claims4
A process for treating aluminum and aluminum alloy substrates to improve the adhesion of subsequently applied electroless or electrolytic nickel deposits which comprises treating the substrate with a solution containing a soluble nickel or cobalt compound having a pH of about 12 or above and a non-cyanide complexing agent for the nickel or cobalt compound capable of maintaining the nickel or cobalt metal in solution at a pH of about 12 or above and which solution is further characterized by the absence of a reducing agent capable of reducing the nickel or cobalt compound to cause a buildup of nickel or cobalt metal on the substrate.
Dependencies are inferred from the claim text.