Right circular substrate packaging
AssigneeThe United States of America as represented by the Secretary of the Army
InventorsVictor W. Ruwe, James A. Kerr, Rene F. Sandeau, Jr.
Life of this patent
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Abstract
Packaging of microelectronics utilizing a series of various size cylinders hich are assembled and sealed from the environment, providing electrical connections out opposite ends of the cylinders and providing for a center opening in the inner cylinder to allow other structure such as a warhead to be mounted therein are aspects of this invention.
Claims5
A cylindrical electronic packaging arrangement comprising a plurality of elongated cylinders of different diameters and having electronic components mounted on surfaces thereof with output leads from the surfaces located at the ends of the cylinders, insulating spacer means between the cylinders and being keyed to the cylinders to space the cylinders relative to each other, an end cap over the end of the cylinders at each end and having connector pins connected through connector means to innerconnect the output leads with the connector pins in the end cap to connect the electronic components out through said end cap, and said end cap being sealed relative to said cylinders.
Dependencies are inferred from the claim text.