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US 4,399,453 AGranted
Low thermal impedance plastic package
AssigneeMotorola, Inc.
InventorsHoward M. Berg, Gary L. Lewis, Curtis W. Mitchell
Life of this patent
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Abstract
A package for fiber optic semiconductor devices is disclosed in which heat is conducted by both a heat spreader and through a plastic enclosure portion of the package.
Claims7
A fiber optic semiconductor device having a low thermal impedance comprising:
- a thermally conductive header;
- a semiconductor chip, having a photo-active area, thermally connected to said header;
- a segment of fiber optically connected to said photo-active area;
- and
- heat spreader means thermally coupled to said header, said heat spreader means extending outwardly from said header for conducting heat away from said semiconductor chip;
- a cylindrical, thermally conductive member orthogonal to and thermally connected to said heat spreader;
- and
- plastic enclosure means engaging said heat spreader for enclosing said semiconductor chip, said cylindrical member, and said fiber, said fiber extending through a surface of said enclosure means, and wherein said cylindrical member conducts heat away from said semiconductor chip through said enclosure means.
5 more elements
Dependencies are inferred from the claim text.