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US 4,399,452 AGranted
Explosion-proof semiconductor device
AssigneeTokyo Shibaura Denki Kabushiki Kaisha
InventorsKazuyuki Nakashima, Youichi Araki, Yukio Igarashi, Shinjiro Kojima
Life of this patent
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Abstract
With a semiconductor device embodying this invention, a semiconductor element is clamped between a pair of electrodes in a housing. A hollow cylindrical explosion-proof member is so set in the housing as to enclose the semiconductor element. The hollow cylindrical explosion-proof element is prepared from soft elastic material capable of absorbing the force of the explosion of the semiconductor element.
Claims12
A semiconductor device comprising:
- (a) a semiconductor element formed substantially in the shape of a disc;
- (b) first and second electrodes for sandwiching therebetween said semiconductor element,
- said first electrode including a first cylindrical portion having a flat first surface contacting said semiconductor element and a second cylindrical portion, integrally formed with said first cylindrical portion and having a diameter larger than the diameter of said first cylindrical portion, said second cylindrical portion further having a flat second surface extending in a radial direction beyond the circumference of said first cylindrical portion,
- said second electrode also including a flat surface contacting said semiconductor element and a cylindrical portion;
- (c) a housing forming an airtight chamber with said first and second electrodes and enclosing said semiconductor element;
- and
- (d) an explosion-proof member for absorbing a force produced by an explosion of said semiconductor element, disposed within said housing and enclosing said semiconductor element, said explosion-proof member including
- a central annular portion having an inner diameter not smaller than the diameter of said semiconductor element,
- a first annular portion integral with one end of the central annular portion and having an inner surface contacting the first cylindrical portion of said first electrode and a flat surface parallel to the flat second surface of said first electrode, and further having at least a first annular projection integrally formed on the flat surface of the first annular portion and extending in the axial direction of the first annular portion at least partially above the flat surface of the first annular portion, said projection having a surface pointing towards the radially extending flat second surface of the second cylindrical portion of said first electrode, and
- a second annular portion integral with the other end of the central annular portion and having an inner surface contacting the cylindrical portion of said second electrode.
7 more elements
A semiconductor device comprising:
- (a) a semiconductor element formed substantially in the shape of a disc;
- (b) first and second electrodes substantially cylindrical in shape, each cylindrical electrode having opposing end surfaces for sandwiching said semiconductor element;
- (c) a housing forming an airtight chamber with said first and second electrodes and enclosing said semiconductor element;
- and
- (d) an explosion-proof member disposed in said housing for enclosing said semiconductor element and for absorbing a force produced by an explosion of said semiconductor element, said explosion-proof member further including
- at least a first component and a second component,
- said first component comprising a first hollow cylinder having an inner diameter not smaller than the diameter of said semiconductor element, said first hollow cylinder having first and second ends extending in the axial direction of said semiconductor element, said first hollow cylinder having a first ring integrally formed with said first end, said first ring extending in the radial direction of said semiconductor element and having an inner peripheral surface contacting the cylindrical surface of said first electrode,
- said second component comprising a second hollow cylinder having an inner diameter not smaller than the diameter of said semiconductor element, said second hollow cylinder extending in the axial direction of said semiconductor element and having first and second ends and a second ring integrally formed with said second end of said second hollow cylinder, said second ring extending in the radial direction of said semiconductor element and having an inner peripheral surface contacting the cylindrical surface of said second electrode, and
- said first and second components being mutually engaged for sliding in the axial direction of said semiconductor element and for maintaining sealing engagement upon explosion of said semiconductor element.
6 more elements
Dependencies are inferred from the claim text.