Silver plating
AssigneeLeaRonal, Inc.
InventorsFred I. Nobel, William Brasch
Life of this patent
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Abstract
The invention relates to silver plating utilizing low cyanide or non-cyanide silver plating baths by treating the substrate to be plated with a mercaptan and to low cyanide or non-cyanide baths containing a bath soluble mercaptan in a sufficient amount to eliminate or effectively reduce immersion plating of the silver onto the substrate.
Claims6
A process for the electrodeposition of silver on a conductive copper or copper alloy substrate which comprises as a step of said process strike plating the substrate in the areas desired to be electroplated with a silver strike solution containing less than about 5 g/l of silver metal in the form of an alkali silver thiosulfate complex, free thiosulfate, and a mercaptan in an amount sufficient to prevent or retard silver deposition by immersion on the substrate and, as a further step of said process, subsequently electroplating the strike plated areas of the substrate by electrodeposition of silver thereon to the desired thickness from an electrodeposition bath solution which contains higher amounts of silver than are contained in the strike solution.
The process of electrodepositing silver on a copper or copper alloy conductive substrate which comprises as a step of said process treating the substrate with a mercaptan compound in the absence of a silver compound, and as a subsequent step of said process electroplating silver thereover with a silver cyanide plating solution containing 10 g/l of free cyanide or less or a silver thiosulfate plating solution containing 5 g/l of silver metal or less.
Dependencies are inferred from the claim text.