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US 4,398,975 AGranted
Conductive paste
AssigneeSony Corporation
InventorsKenji Ohsawa, Takao Ito, Koichiro Tanno, Masayuki Ohsawa, Keiji Kurata
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Abstract
A novel conductive paste and a method of making the same in which metallic gallium is combined with a metal or alloy which forms a eutectic with gallium in an amount in excess of its limit of solubility in gallium at a specific temperature. This melt is then treated with a metal powder of a second metal or alloy which alloys with gallium to produce a higher melting alloy, the second metal powder being coated on its surface with the eutectic-forming metal.
Claims10
A conductive paste comprising:
- a continuous phase of metallic gallium in combination with a first metal which forms a eutectic with gallium, said metal being present in excess of its solubility limit in gallium at a predetermined temperature,
- in combination with a second metal powder capable of alloying with gallium, said powder being pre-coated with said first metal and being dispersed through said continuous phase.
A method for making a conductive composition which comprises:
- providing a molten mixture of gallium and a first metal which forms a eutectic with gallium at a temperature in excess of the melting point of said metal,
- cooling the resulting melt to a lower temperature,
- adding to the cooled melt a powder having a central core of a second metal or alloy capable of alloying with gallium to form a gallium alloy of a higher melting point than the gallium itself, said core being pre-coated with said first metal, and
- agitating the resulting mixture to disperse said powder within said melt.
1 more element
Dependencies are inferred from the claim text.