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US 4,398,660 AGranted
Method of mounting electronic components
AssigneeRCA Corporation
InventorsThomas R. Pampalone, Anthony Z. Miller
Life of this patent
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Abstract
An improved method for mounting leadless electronic components on printed circuit boards so they can be soldered in place is disclosed. The method utilizes an acrylate adhesive composition which is rapidly cured in two stages by treatment with gaseous sulfur dioxide followed by heat.
Claims9
A method of mounting leadless electronic components on a printed circuit board comprising:
- (a) temporarily attaching said components to said board with an adhesive composition comprising:
- (1) 30 to 80% by weight of one or more liquid monomers each containing one or more acrylate moieties;
- (2) a finely particulate inert filler;
- (3) an effective amount of a free radical initiator containing a hydroperoxide moiety to allow partial curing of the adhesive composition upon exposure to gaseous sulfur dioxide;
- (4) an effective amount of a thermal initiator to allow complete curing of the adhesive composition upon exposure to heat;
- and
- (5) a polymeric binder soluble in said liquid monomers in an amount required to provide the desired flexibility and resiliency to the cured adhesive composition;
- (b) exposing the board to gaseous sulfur dioxide to partially cure said adhesive composition;
- (c) heating the board to complete the cure of said adhesive composition thereby rigidly attaching said components thereto;
- and
- (d) soldering said components to said board.
8 more elements
Dependencies are inferred from the claim text.