Marking apparatus for plastic encapsulated semiconductor devices

A marking apparatus for marking at least one plastic encapsulated semiconductor device with marking-obstructive substances thereon comprising a conveying mechanism for conveying the semiconductor device, a pretreatment mechanism for removing the marking-obstructive substances from the top surface of the semiconductor device conveyed thereto by the conveying mechanism, a stamping mechanism for stamping a mark on the semiconductor device having the marking-obstructive substances removed therefrom by the pretreatment mechanism and transferred thereto by the conveying mechanism, and a curing mechanism for curing the mark stamped on the semiconductor device transferred thereto by the conveying mechanism;

• said conveying mechanism including endless chains, a plurality of carrying members disposed on the endless chains to move together therewith and conveyed in accordance with the drive of the endless chains, each carrying member bearing at least one semiconductor device, a plurality of feed members attached to the endless chains, each feed member engaging the corresponding carrying member so that the carrying member may be moved by the feed member, and an intermittent drive mechanism for driving carrying members and stopping carrying members at positions where the carrying members severally face the pretreatment mechanism, the stamping mechanism, and the curing mechanism;
• said pretreatment mechanism including torch nozzles severally facing the semiconductor devices and emitting flames from their respective distal ends, a support mechanism for rotatably supporting the torch nozzles between a first position where the distal ends of the torch nozzles face their corresponding semiconductor devices and a second position where the distal ends do not face the semiconductor devices, and a driving mechanism for driving the torch nozzles to rotate between the first and second positions, the distal ends of each torch nozzle facing the top surface of each corresponding semiconductor device when the torch nozzle is in the first position, and the marking-obstructive substances on the top surface are removed by burning the top surface with a flame from the torch nozzle in the first position, whereby said top surface is pretreated, said driving mechanism moving the distal end of each torch nozzle in the first position along the top surface of each corresponding semiconductor device, whereby the whole area of said top surface is pretreated;
• said stamping mechanism including rubber stamps severally facing the semiconductor devices and inked correspondingly to the marks and an abutment mechanism for causing the rubber stamps to abut against their corresponding pretreated semiconductor devices, whereby stamping is achieved by transferring ink attached to the rubber stamps to their corresponding pretreated semiconductor devices, said ink being formed of a material which is hardened by ultraviolet rays;
• and
• said curing mechanism being provided with a lamp emitting ultraviolet rays.