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US 4,396,900 AGranted
Thin film microstrip circuits
AssigneeThe United States of America as represented by the Secretary of the Navy
InventorRonald D. Hall
Life of this patent
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Abstract
A four layer thin film metallization system is comprised of layers of tantalum, chromium, copper and gold and is useful in high resolution, low loss microstrip circuits. The metallization system is compatible with lead-tin solder and, in addition, provides low insertion losses at X-band frequencies.
Claims1
A thin film microstrip circuit having low insertion loss at X-band frequency and being highly solderable with lead-tin solder comprising,
- a non-metallic substrate,
- a layer of tantalum fused onto said substrate,
- a layer of chromium having a thickness of about 200 Angstroms fused onto said layer of tantalum,
- a layer of copper having a thickness of about 50,000 Angstroms fused onto said layer of chromium, and
- a layer of gold having a thickness of about 7,000 Angstroms fused onto said layer of copper.
2 more elements
Dependencies are inferred from the claim text.