Method of forming a conductive connection

A method of forming a conductive connection between predominantly miniature members, at least one of which is coated with a flowable insulation, comprising the steps of:

• pressing said members together and heating them by means of electrodes;
• introducing a solder alloy into the location of said connection between said members;
• application to said electrodes first, second and third current pulses in succession;
• passing through said electrodes said first current pulse to destroy said flowable insulation coating of one of said members in the location of said connection between said members;
• passing through said electrodes and said members said second current pulse to effect a weld between said members;
• application to said electrodes said third current pulse prior to raising said electrodes from said members;
• heating said members to a temperature in excess of the melt points of said solder alloy and flowable insulation coating;
• melting said solder alloy and said flowable insulation coating adjacent to the weld joint formed between said members;
• cleaning said electrodes of said flowable insulation coating;
• withdrawing said electrodes from contact with said members, solder alloy and flowable insulation coating while said solder alloy and flowable insulation coating are in a melted state;
• and
• quenching said third current pulse after withdrawing said electrodes from said members for cleaning said electrodes of said flowable insulation coating.