Encapsulated electronic devices and encapsulating compositions
AssigneeWestern Electric Company, Inc.
InventorChing-Ping Wong
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Abstract
An electronic device such as an integrated circuit is encapsulated within a silicone resin formulation having a protonated heterocyclic compound contained therein. The compound complexes with free anionic contaminants to form a non-migratory, non-corrosive protonated heterocyclic compound-anion complex, thereby preventing anionic attack of metallic circuit elements.
Claims36
A method of immobilizing free anions on an electronic device which comprises applying to the device a room temperature vulcanizable silicone elastomer containing therein a protonated heterocyclic compound having a charge and dimension to firmly bind said free anions.
An article of manufacture comprising an electronic device having a room temperature vulcanizable silicone elastomer encapsulant thereover, said encapsulant comprising a protonated heterocyclic compound thereon having a charge and dimension to firmly bind anionic contaminants.
A composition of matter comprising a room temperature vulcanizable silicone elastomer having dissolved therein a protonated heterocyclic compound having a charge and dimension sufficient to firmly bind anionic contaminants.
A method of immobilizing free anions on an electronic device which comprises applying to the device a protonated heterocyclic compound having a charge and dimension sufficient to firmly bind said free anions and an encapsulate for said device.
An article of manufacture comprising an electronic device having a polymeric encapsulate thereover, said encapsulate comprising a protonated heterocyclic compound having a charge and dimension so as to firmly bind anionic impurities.
A composition of matter comprising a polymeric encapsulant having dissolved therein a protonated heterocyclic compound having a charge and dimension sufficient to entrap anionic contaminants.
Dependencies are inferred from the claim text.