Solderable conductive employing an organic binder
AssigneeCTS Corporation
InventorCraig N. Ernsberger
Life of this patent
Estimating the term…
Abstract
A conductive layer (13) adhesively joined to an electrically inert substrate (10) by an organic binder component. The organic binder consists of a resin not substantially less than 15% nor more than about 35% by weight of the composition which further includes dispersed metallic material within the binder and forming the electrically conductive component of the solderable material. A solderable surface layer (15) of the conductive layer (13) includes exposed metallic material suitable for solder bonding terminations (16) to the conductive layer (13), such solderable surface layer (15) being adhesively joined to the binder by means of the organic matrix.
Claims13
A solderable conductive composition forming a conductive layer on a substrate and suitable for forming an adhesive bond with solder, comprising a solderable material including an organic, generally pyrolytically decomposed-at-the-surface-only cycloaliphatic epoxy binder and comprising not less than 15 percent and not more than 35 percent by weight of the composition forming said solderable material, a plurality of discrete metallic particles dispersed within said binder for forming an electrical connection between said conductive layer and solder, and a solderable surface layer of said conductive layer characterized by a continuous phase of metallic particles readily bondable with solder and said surface layer rigidly affixed to the subjacent material by said binder.
A method for producing a solderable conductive layer on a substrate, comprising the steps of (a) mixing together cycloaliphatic epoxy binder and particulate metallic materials which serve as the conductive component of said layer wherein said metallic materials comprise 65% to 85% by weight of said mixture, (b) selectively disposing such composition onto a substrate, with said binder providing the adhesive agent between said substrate and the composition, (c) curing said composition to a heat hardened condition which is both stable and substantially inert, and (d) pyrolytically decomposing a surface layer of said composition by effecting pyrolytic decomposition at the surface only of said composition to provide for solderable adhesion of an electrically conductive termination to said surface layer.
Dependencies are inferred from the claim text.