Package for a pallet-less, multi-layer load comprising a layer of reduced width defining lateral spaces for gripping purposes
AssigneeThimon, S.A.
InventorJacques Thimon
Life of this patent
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AssigneeThimon, S.A.
InventorJacques Thimon
Estimating the term…
A packing for a pallet-less multi-layer load with a layer of reduced width defining lateral spaces for gripping purposes, each of these spaces, which are parallel to each other, having the form of a right-angled dihedron, comprises a plastic film element for protection and reinforcement applied on the reduced layer and the spaces for gripping. The protecting and reinforcing element is provided, in its parts adapted to be applied respectively on the faces of the dihedrons forming the spaces for gripping, with at least one additional band or strip folded inwardly and forming an extra thickness on the two faces of each of these dihedrons. The protecting and reinforcing element of plastics film is advantageously constituted by a section of sheath with gussets, the gussets being disposed either perpendicularly or parallel to the spaces for gripping.
In a packing for a pallet-less multi-layer load having a portion forming a layer of reduced width relative to the width of said load, said layer of reduced width having lateral spaces, gripping means in said lateral spaces for gripping said layer of reduced width, each of said gripping means including a vertical face and a horizontal face, the vertical faces being parallel to each other, said gripping means each having the form of a right-angled dihedron, comprising:
Dependencies are inferred from the claim text.