Multiple use component spacer and methods for preparing a spacer for mounting on and affixing a spacer to a circuit board
AssigneeMotorola, Inc.
InventorErwin R. Polcyn
Life of this patent
Estimating the term…
Abstract
A multiple use component spacer having a component platform defining an aperture, having a plurality of lead grasping portions each having forked resilient portions defining a lead receiving slot for firm engagement with the leads of a range of packages without requiring the use of adhesives, having a plurality of lead abutment portions on its circumference, and having a plurality of feet on at least one surface.
Claims5
A multiple use component spacer, having a circumference and a plurality of surfaces for use in conjunction with a circuit board and components to be mounted on said board, said spacer comprising:
- a central portion having a component platform surrounding a lead receiving aperture suitable for passing a lead to be soldered to the circuit board;
- a first lead grasping portion affixed to said central portion, directed outwardly therefrom in a first direction and having a resilient forked portion defining a lead receiving slot;
- a second lead grasping portion having a resilient forked portion defining a lead receiving slot affixed to said central portion and directed outwardly therefrom in a direction different from that of said first lead grasping portion;
- a plurality of lead abutment portions distributed about the circumference of the spacer;
- and
- means for providing elevation of said component platform above a circuit board, said means for providing elevation being located on at least one of the surfaces of the spacer.
A multiple use component spacer having a circumference and a plurality of surfaces for use in conjunction with a circuit board and components to be mounted thereon, comprising:
- a component platform defining a lead receiving aperture;
- a plurality of resilient forked lead grasping portions affixed to and directed outwardly from said component platform;
- each of said forked resilient portions defining a lead receiving slot for providing a grasping action;
- a plurality of lead abutment portions on the circumference of the spacer for restraining movement of the spacer by pressing against the leads of a component;
- and
- a plurality of feet projecting from at least one surface of the spacer farther in at least one direction than any other portion of the spacer.
A method of affixing a component having leads to a circuit board in spaced relationship from the circuit board comprising the steps of:
- providing a multiple use component spacer having a circumference, having lead grasping portions, having a central aperture and having abutment niches about said circumference;
- grasping at least one lead of the component with at least one of said lead grasping portions and passing at least one lead of the component through said central aperture;
- and
- affixing the component to the board with the spacer positioned between the component and the board.
A method of preparing a component for mounting on a circuit board comprising the steps of:
- providing a multiple use component spacer having a circumference, having a plurality of lead grasping portions, having a central aperture and having abutment niches about said circumference;
- and
- grasping at least one lead of the component with at least one of said plurality of lead grasping portions and passing at least one lead of the component through said central aperture.
Dependencies are inferred from the claim text.