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US 4,395,504 AGranted
Adhesive system for particleboard manufacture
AssigneeSun Chemical Corporation
InventorsTheodore Sulzberg, Chi Ma
Life of this patent
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Abstract
A formaldehyde-free adhesive system for the manufacture of particleboard comprises the reaction product of a cyclic urea and glyoxal in an equivalent ratio of about 1.1-1.5:1.
Claims5
In a particleboard that comprises particles of wood and a formaldehyde-free resin adhesive system, the improvement wherein the resin adhesive system comprises the product of the reaction of a cyclic urea and glyoxal in the equivalent ratio of about 1.1-1.5:1.
A formaldehye-free resin adhesive system for particleboard which comprises a cyclic urea:glyoxal condensate wherein the equivalent ratio of the cyclic urea:glyoxal is about 1.1-1.5.
Dependencies are inferred from the claim text.