Electroconductive resin composite material for molding
AssigneeKureha Kagaku Kogyo Kabushiki Kaisha
InventorsHiroaki Satoh, Masaru Hiruta
Life of this patent
Estimating the term…
Loading patent…
AssigneeKureha Kagaku Kogyo Kabushiki Kaisha
InventorsHiroaki Satoh, Masaru Hiruta
Estimating the term…
An electroconductive resin composite material for molding having excellent mechanical strength and electrical properties. The resin comprises 100 parts by weight of polypropylene, from 10 to 50 parts by weight of a modified polypropylene obtained either by chemically modifying polypropylene with an organic unsaturated carboxylic acid or by copolymerizing propylene and the organic unsaturated carboxylic acid, from 5 to 65 parts by weight of carbon fiber having a diameter of 5 to 20 micrometers, the ratio of length to diameter of the fiber being not less than 10, and from 5 to 65 parts by weight of electroconductive carbon black, the specific surface area being at least 800 m.sup.2 /g.
A resin composite material consisting essentially of 100 parts by weight of polypropylene, from 10 to 50 parts by weight of a modified polypropylene, said modified polypropylene being polypropylene chemically modified with an organic unsaturated carboxylic acid of 3 to 10 carbon atoms or a copolymer of propylene and an organic unsaturated carboxylic acid of 3 to 10 carbon atoms, said modified polypropylene containing 0.5 to 8.0 mol% of said organic unsaturated carboxylic acid as carboxylic acid units, from 5 to 65 parts by weight of carbon fiber having a diameter of from 5 to 20 micrometers and a ratio of length to diameter of not less than 10 and from 5 to 65 parts by weight of electroconductive carbon black having a specific surface area of not less than 800 m.sup.2 /g.
Dependencies are inferred from the claim text.