Apparatus for producing electrodeposited wires

An apparatus for electroplating a wire to provide the wire with an electrolytic plating layer, comprising:

• a plurality of electroplating stations arranged in a row, each electroplating station comprising an electrolytic bath (3) for coating the wire with an electrolytic plating layer, drive means (5, 5') for passing the wire through the electrolytic baths (3) in a given travel direction, and a plurality of smoothing stations (4) each comprising means (411, 412, 413, 414) for smoothing the surface of the wire substantially over the entire periphery thereof, said smoothing stations being arranged so that at least one smoothing station is located downstream of each electroplating station (3) as viewed in said travel direction, whereby said smoothing stations and said electroplating stations are arranged in alternate sequence with each other for achieving a smooth-surfaced compact electrolytic plating layer, said surface smoothing means (411, 412, 413, 414) comprising at least four rotatable rollers arranged along and adjacent to the wire in each smoothing station, said rollers being spaced apart from one another and so positioned that substantially the entire periphery of the wire is contacted as it passes through each smoothing station, each of said rollers having a circumferential groove with a rounded groove bottom in its peripheral surface to abut on the outer peripheral surface of the wire in a compressive manner so that the surface of the wire is brought into compressing contact with the rollers each of said rotatable rollers having a rotational axis extending substantially perpendicularly to the travel direction of the wire.