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US 4,394,710 AGranted
Die-stamped circuit board assembly for photoflash devices
AssigneeGTE Products Corporation
InventorsBoyd G. Brower, David R. Broadt, John W. Shaffer
Life of this patent
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Abstract
A circuit board assembly wherein the assembly includes a dielectric substrate, at least one radiation sensitive switch, and at least one conductive member in electrical contact with the switch. Portions of the switch and the conductive member are die-stamped into the dielectric substrate to achieve the contact without severing the switch material.
Claims15
A circuit board assembly for use within a photoflash device, said circuit board assembly comprising:
- a dielectric substrate;
- at least one thin, electrically conductive switching element having a portion thereof die-stamped an established distance within a surface of said substrate;
- and
- at least one thin, electrically conductive metallic member die-stamped within said surface of said substrate simultaneously with said switching element and having a part thereof located on said die-stamped portion of said switching element, said die-stamping electrically connecting said conductive member to said portion of said switching element and securedly positioning both said conductive member and said switching element on said dielectric substrate without severing said switching element.
1 more element
Dependencies are inferred from the claim text.