Die-stamped circuit board assembly having relief means to prevent total switch deformation
AssigneeGTE Products Corporation
InventorsBoyd G. Brower, John W. Shaffer
Life of this patent
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Abstract
A photoflash device circuit board assembly including a dielectric substrate and at least one switching element and conductor die-stamped therein. To assure that the delicate switch is not severed by the die's cutting edge during die-stamping, a relief means (e.g., slot) is provided within the substrate so that a segment of the switch can be aligned therewith. As an alternative, it is taught to provide stepped portions within the die's cutting edge to align with preselected portions of the switch and thus prevent total severance thereof.
Claims11
A circuit board assembly for use within a photoflash device, said circuit board assembly comprising:
- a dielectric substrate;
- a thin, electrically conductive switching element positioned on said dielectric substrate and having a portion thereof die-stamped an established distance within a surface of said dielectric substrate;
- an electrically conductive member die-stamped within said surface of said dielectric substrate simultaneously with said switching element and having a part thereof located on said portion of said switching element die-stamped within said substrate, said die-stamping electrically connecting said conductive member to said portion of said switching element;
- and
- relief means located within said dielectric substrate for preventing total severing of said switching element during said die-stamping thereof within said dielectric substrate, at least one segment of said portion of said switching element die-stamped within said substrate being aligned with said relief means during said die-stamping and thereafter being positioned within said relief means such that said segment is not severed, at least one part of said die-stamped portion of said switching element adjacent said die-stamped segment of said portion being deformed or severed by said die-stamping.
Dependencies are inferred from the claim text.