Electrical circuit package
AssigneeBell Telephone Laboratories, Incorporated
InventorJohn J. Consoli
Life of this patent
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Abstract
An electrical circuit package is disclosed that provides an electrically insulating protection cover for an integral circuit board assembly. The package includes a flexible dielectric substrate 10. A first portion 12 of the dielectric substrate has one or more electrically conductive paths 20 located thereon and one or more electrical components 30 supported thereon and electrically connected to the conductive paths. A second portion 14 of the dielectric substrate 10 is free of any paths or electrical components. The second portion is folded over and secured to the first portion to provide a protective enclosure.
Claims3
An electrical circuit package comprising:
- a flexible dielectrical substrate;
- a single first portion of the dielectrical substrate having located thereon all electrically conductive paths and all electrical components associated with the circuit package, the components being electrically connected to the conductive paths on the first portion;
- at least one electrical component supported on the first portion of the substrate including an integral catch remote to the electrical connection of the component to the conductive paths on the first portion;
- and
- a single second portion of the dielectric substrate extending lengthwise from the first portion, the second portion being free of any electrically conductive paths and electrical components, the second portion having integral means for cooperating with the catch on the component to secure the two portions together, the second portion being at least equal in length to the first portion and being folded over and secured to the first portion to provide an electrically insulating protective cover for the components.
Dependencies are inferred from the claim text.